Qorvo’s SiC-FET, with the new ability of size reduction using SiC, technology has extended its lead in developing a 750V device with a TO-Leadless (TOLL) package.

The Packing Factor: Compared with TO-247 and D2PAK, the TOLL package is 30% smaller in volume and half the height at 2.3 mm.

It’s a fact that Qorvo’s SiC-FETs have the lowest RDS(ON) in the industry. This Low RDS(ON) allows for a high current rating using a smaller package. So, with this size reduction—we can put a 750 V SiC-FET inside a TOLL package.

Qorvo’s SiC-FET, When compared  with Si MOSFETs—in soft-switching applications, the has lower conduction losses and higher operating frequency—and the additional lower switching losses in hard-switching applications. When comparing with other SiC technologies on the market—Qorvo SiC-FETs provide a higher operating frequency and lower conduction loss.