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IPP’s New Cool Chip: Aluminum Nitride Ceramic Chip Used To Transfer Heat

IPP’s New Cool Chip: Aluminum Nitride Ceramic Chip Used To Transfer Heat

IPP’s Cool Chip is designed to draw heat from one location that is too hot and move it to a different location that can absorb the heat. These devices are manufactured on a highly thermally conductive ceramic substrate (Aluminum Nitride) that is electrically isolated and safe to use. The terminals are gold-plated over nickel, making them easy to solder with many different alloy types. These devices are ideal for small, compact areas with high heat concentrations, intended for both military and commercial applications. The Cool Chips come with or without an edge wrap in three sizes: 0805, 1010, and 1206. Cool Chips are made in the USA with the same high quality that IPP is known for.

APPLICATIONS:

  • PIN and Laser Diodes
  • RF Amplifiers
  • Capacitors, Transistors
  • Power Supplies
  • Filters, Resistors

Download Cool Chip Technical Data Sheet with test results.

Part Numbers Length: inches (mm) Width: inches (mm) Depth: inches (mm) Thermal Resistance (W/°C) Capacitance Series (pF) Capacitance Shunt (pF)
IPP-CCN0805-40 0.080 (2.032) 0.050 (1.270) 0.020 (0.508) 9.26 < 0.10 < 0.10
IPP-CCN0805-40N 0.080 (2.032) 0.050 (1.270) 0.020 (0.508) 13.9 < 0.10 < 0.10
IPP-CCN1206-40 0.120 (3.048) 0.060 (1.524) 0.025 (0.635) 11.58 < 0.10 < 0.10
IPP-CCN1206-40N 0.120 (3.048) 0.060 (1.524) 0.025 (0.635) 14.67 < 0.10 < 0.10
IPP-CCN1010-40  0.100 (2.540) 0.100 (2.540) 0.020 (0.508) 5.8 < 0.10 < 0.15
IPP-CCN1010-40N 0.100 (2.540) 0.100 (2.540) 0.020 (0.508) 9.26 < 0.10 < 0.15

Visit IPP’s website to view the Cool Chip Heat Spreaders

Contact us for more information.

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